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Combined ellipsometry and scatterometry in a single tool |
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Sep 27, 2005 at 09:37 PM |
 Product Briefing Outline: Rudolph Technologies, has
launched the ‘ultra-II CD' system for optical critical dimension (OCD)
and thin film metrology in a single tool. The ultra-II CD introduces
Rudolph's new Simultaneous Multi-angle LASER ‘SiMuLASE Scatterometry,'
a CD measurement technique based on its high-performance patented
Focused Beam Ellipsometry (FBE) technology. The combination of FBE and
‘SiMuLASE Scatterometry' provides high-speed, non-destructive CD
metrology, as well as thickness and optical property measurements for
transparent films with superior accuracy, repeatability, and
tool-to-tool matching, according to the company.
Problem: The ultra-II eliminates the need for separate CD and
film thickness tools, and therefore can offer low cost of ownership,
reduce transport delays, and provide
rapid notification of yield excursions for deposition, lithography, and
etch processes without compromising industry-leading performance.
Solution: Focused Beam technology, based on the simultaneous
collection of data at multiple wavelengths and multiple angles,
provides for unsurpassed performance in both CD and film thickness
measurement applications. FBE has traditionally offered industryleading
performance when measuring ultrathin films on test wafers or planar
test structures, but this capability has now been extended to patterned
structures that
manufacturers are increasingly adopting to more closely represent how a
process will perform on active die. Its OCD capabilities have been
specifically developed in collaboration with semiconductor
manufacturers to meet process control requirements at the 65nm node and
beyond for advanced transistor formation processes, including shallow
trench isolation, poly-gates, and sidewall spacers. The ultra-II
optical system provides film thickness measurements with long-term
repeatability of 0.03 Ångstroms. The small spot size of the ultra-II CD
permits measurements on shrinking test structures - as small as 50x50
um - within the scribe line or active die region to meet current and
future process requirements.
Applications: CMP, CVD, etch, lithography.
Platform: The ultra-II CD system includes offline modeling with
advanced recipe optimizer and sensitivity analysis for highly automated
recipe creation. The tool-based ‘SmartSearch' data analysis is claimed
to maintain the ultra-II's industry-leading throughput for CD
applications.
Availability: July 2005 onwards.
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Product Briefings 
