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Bevel-edge defect inspection in a single pass |
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Sep 27, 2005 at 09:13 PM |
 Product Briefing Outline: Olympus Integrated
Technologies America's (Olympus-ITA) new AL Series optical inspection
and defect review system delivers wafer edge and bevel inspection.
Olympus' full bevel inspection will allow the user to see the top,
side, and bottom of the wafer from various angles using a continuous
angle
adjustment for best imaging and defect detection.
Problem: Edge die yield remains one of the big challenges in IC
manufacturing with a variety of edge defects contributing to loss. A
300mm wafer has 942mm of edge, giving you nearly one meter of edge die
on every wafer. If edge defects are reduced, wafer yield improves.
Olympus's new edge and bevel inspection technology enables
semiconductor manufacturers to detect these defects early in the
manufacturing process and track them through the process.
Solution: Macro inspection includes both front side and back side
(back center and edge) in a single wafer pass. Micro inspection allows
the operator to view the wafer
under a range of magnifications and imaging techniques that include
bright field, dark field, Nomarski DIC, confocal, and high resolution
DUV and DUV confocal. This will
maximize the user's ability to detect particles, pits and residues that
lead to hot spots on the front side, chips, cracks, and scratches that
cause wafer breakage, and edge
bead removal issues that not only harm the individual wafer, but can
result in equipment and wafer cross contamination. Defect information
and images are stored in a common defect format for tracking and yield
analysis. Defect review can be added to the systems in a manual mode
where the operator classifies on or off-line, or in a fully automated
mode using automatic defect classification (ADC) with high throughput
and accuracy. Defects are imaged, stored, and classified; the defect
data is stored in a common format and can be uploaded to the user's
yield management database.
Adding edge and bevel inspection to this system provides the complete wafer inspection system.
Applications: Defect inspection of wafer bevel edge, top-side and bottom.
Platform: The systems include a variety of visible light imaging
methods using Olympus Universal Infinity Systems (UIS) infinity
corrected optics for superior imaging
and resolution. The systems can also integrate Olympus' 248 nanometer
patented Deep-UV Air Gap optics to increase the optical resolution
limit to 80 nanometers. The
systems are available with complete GEM and GEM300 factory automation
software for seamless integration into the user's automated factory. A
variety of SEMI compliant load ports (FOUP, FOSB, SMIF, open cassette)
can be attached to the systems in various configurations (front, rear,
or side load) to allow the system to meet any
manufacturing floor layout requirement.
Availability: July 2005 onwards.
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Wafer Processing 