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Inspection tool streaks ahead |
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Sep 27, 2005 at 08:59 PM |
 Product Briefing Outline: KLA-Tencor has launched its
new Puma 9000 patterned wafer inspection platform-the first in a suite
of next generation inspection solutions. Developed in close
collaboration with customers to address the new defect and yield
challenges emerging at the 65nm and 45nm nodes, the Puma 9000 combines
a highly modular and extendible architecture with KLA-Tencor's ‘Streak'
imaging technology to enable the highest possible capture of critical
defects at production throughputs, according to the company.
Problem: Speeding time to market has never been more essential
to profitability, while chip manufacturers face new demands such as
cost sensitivity. As a result, there is a growing need for more
powerful, high-value inspection systems to speed yield ramps, time to
market and return on investment (ROI) on next-generation chips.
Solution: KLA-Tencor's ‘Streak‘ darkfield imaging technology is
claimed to overcomethe fundamental limitations of traditional scanning
laser and photo multiplier tube (PMT)-based inspection systems.
Scalable for multiple technology generations, Streak combines advanced
ultraviolet (UV) illumination optics with high-speed imaging to provide
a range of inspection modes optimized for critical defect detection
without
compromising throughput. A proprietary solid-state linear sensor is
used to image the scattered light, which extends the dynamic range of
the sensor to produce the best available signal-to-noise ratio, as well
as a much more stable and repeatable measurement than can be achieved
using PMTs. Puma 9000 retains the historical darkfield advantages of
highly effective noise suppression and pattern filtering for improved
defect capture on critical layers. Onboard inline automated defect
classification (iADC) technology enables realtime classification and
intelligent sampling, allowing customers to focus on their defects of
interest.
Applications: Wafer Processing
Platform: The Puma 9000 architecture features a modular design
with extendibility for multiple technology generations. Configurable by
application, the Puma 9000 provides IC manufacturers with the advantage
of a single-platform solution for the broadest range of inspection
applications in both memory and logic production, plus cost-effective
upgrade paths for future expansion. In addition, the system shares a
common user interface with KLA-Tencor's latest brightfield and e-beam
inspection systems, which reduces operator training and improves ease
of use for rapid integration into production.
Availability: July 2005 onwards.
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Wafer Processing 
