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Product Briefing Outline: The SEZ Group has launched the new ‘Esanti' platform targeting front-end-of-line (FEOL) cleaning and resist-stripping processes for 45nm and below. It builds on the company's core spin-processor technology, adding new capabilities that enhance defect removal and surface drying to effectively address a wide range of high-volume manufacturing applications. SEZ's proprietary Enhanced Sulfuric Acid ‘ESA' strip process is also optimized for deployment with the Esanti platform. SEZ reports that it has multiple Esanti systems in beta test with customers.

Problem: Demand for greater process control with reduced cycle times and costs continues as process complexity and smaller feature sizes require improved cleaning capabilities. Once dominated exclusively by batch processes (wet benches and spray tools), the cleaning market has transitioned in recent years to single-wafer approaches in the back-end-of-line (BEOL). Single-wafer processes are claimed to deliver significantly improved defect density via minimal cross-contamination (both intra- and inter-wafer) with superior process control, uniformity, cycle times and matching to other single-wafer tools in volume production environments.

Solution: The Esanti platform features a multiple open-chamber design that delivers the flexibility to address either a broad range of FEOL cleaning applications that include pre-diffusion, pre-gate, contact and pre-metal cleans, or high-temperature (140°C) post-strip/ash, post-etch and post-implant wet resist stripping and cleaning, and photoresist rework. The platform integrates proven capabilities previously integrated into SEZ's ‘Da Vinci' platform, such as polymer cleaning and backside treatment, with a range of new features. Chief among these are double-side treatment capability, Active-Jet spray technology for enhanced defect removal, and SEZ's proprietary atmospheric surface drying (ASD) technology, which prevents watermark formation and pattern collapse on a variety of structures during the drying process.

Applications: Pre-diffusion, pre-gate, contact and pre-metal cleans, or high-temperature (140°C) post-strip/ash, post-etch and post-implant wet resist stripping and cleaning, and photoresist rework.

Platform: Esanti platform tools will be available in a variety of configurations. Customers can select a four- or eight-chamber version, compatible with either 200-mm or 300-mm wafers. The platform boasts batch-comparable throughputs and a flexible, external chemical-delivery system that enables use of up to four chemicals and process-chamber levels, so that more than one process can be run in the same tool with minimal impact. Separate drains and exhaust for different chemistries facilitate changes in chemical sequence without necessitating a chamber change.

Availability: November 2006 onwards.