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New ‘cure’ for porous low-k film deposition |
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Sep 27, 2005 at 07:33 PM |
Product Briefing Outline: Applied Materials
has unveiled the ‘Applied Producer Black Diamond II' system for
depositing the advanced low-k film. Providing a k-value of less
than 2.5, the Black Diamond II system utilizes Applied's ‘NanoCure'
UV(1) curing technology to achieve a robust, manufacturable film
compatible with CMP(1) and packaging processes. According to the
company, Black Diamond II enables the continued scaling of copper/lowk
interconnects to 45nm and beyond.
Problem: Low-k films will pose even more
integration challenges than previously due to the need for the pores to
be uniformly distributed throughout the film (x,y, and z dimensions) to
maintain an isotropic dielectric constant, providing a predictable
electrical performance. Pores must also be fully closed to prevent
contamination
of the k value.
Solution: The Black Diamond II process involves the
co-deposition of SiO backbone and organic species in a plasma enhanced
chemical vapor deposition (PECVD) chamber. A UV cure is used to induce
porosity and strengthen the SiO backbone. Small average pore size and
tight distribution obviates the need for pore sealing. Curing also
enhances the mechanical properties, enabling the film to withstand the
rigors of process integration and packaging. The film is designed for k
integrity and yield in a dual-damascene integration process. Ideally
suited for advanced applications where
control of film interfaces is critical, the BD II chamber's
single-wafer processing enables in-situ treatment and precise interface
control with minimal impact to throughput. The resulting film provides
an integration ready solution to meet the ILD requirement for
45nm/65nm high-performance and provides capability on the same hardware to reach k<2.2.
Applications: Ultra low-k deposition, 65nm to 45nm.
Platform: The NanoCure chamber features a ‘snap on' UV
lid/CVD lower chamber and in-situ chamber cleaning technology for
high-volume manufacturability and Producer platform extendibility.
Availability: July 2005 onwards.
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Product Briefings 
