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New ‘cure’ for porous low-k film deposition |
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Sep 27, 2005 at 07:33 PM |
 Product Briefing Outline: Applied Materials has
unveiled the ‘Applied Producer Black Diamond II' system for
depositing the advanced low-k film. Providing a k-value of
less than 2.5, the Black Diamond II system utilizes Applied's
‘NanoCure' UV(1) curing technology to achieve a robust,
manufacturable film compatible with CMP(1) and packaging
processes. According to the company, Black Diamond II
enables the continued scaling of copper/lowk interconnects
to 45nm and beyond.
Problem: Low-k films will pose even more integration
challenges than previously due to the need for the
pores to be uniformly distributed throughout the film
(x,y, and z dimensions) to maintain an isotropic dielectric
constant, providing a predictable electrical performance.
Pores must also be fully closed to prevent contamination
of the k value.
Solution: The Black Diamond II process involves the
co-deposition of SiO backbone and organic species
in a plasma enhanced chemical vapor deposition
(PECVD) chamber. A UV cure is used to induce porosity
and strengthen the SiO backbone. Small average pore
size and tight distribution obviates the need for pore
sealing. Curing also enhances the mechanical properties,
enabling the film to withstand the rigors of process
integration and packaging. The film is designed for k
integrity and yield in a dual-damascene integration
process. Ideally suited for advanced applications where
control of film interfaces is critical, the BD II chamber's
single-wafer processing enables in-situ treatment
and precise interface control with minimal impact to
throughput. The resulting film provides an integration
ready solution to meet the ILD requirement for
45nm/65nm high-performance and provides capability
on the same hardware to reach k<2.2.
Applications: Ultra low-k deposition, 65nm to 45nm.
Platform: The NanoCure chamber features a ‘snap on'
UV lid/CVD lower chamber and in-situ chamber cleaning
technology for high-volume manufacturability and
Producer platform extendibility.
Availability: July 2005 onwards.
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Product Briefings 
