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New polycarbonate reduces ionic out-gassing from fab equipment |
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Oct 08, 2004 at 09:00 PM |
 Product Briefing Outline: GE Advanced Materials has
announced ultra-clean "LEXAN" LI1911R polycarbonate (PC) resin for
improved out-gassing properties compared to standard PCs. The unique
LEXAN resin grade is designed to ensure cleanliness levels required in
the most demanding wafer handling operations such as 300mm
front-opening unified pods (FOUPs), frontopening shipping boxes
(FOSBs), and 150/200mm wafer shipping boxes.
Problem: In today's cleanroom operations, where plastics are
used in a variety of applications, even slight levels of contamination
from out-gassing can impact quality and reduce the service life of
electronic applications. Although improvements have been made such as
mini-environments to reduce airborne molecular contamination, equipment
remains a key source of repetitive contamination source. To address
this, LEXAN LI1911R resin undergoes a unique manufacturing process that
significantly lowers out-gassing and also minimizes extractable ionic
species.
Solution: The new resin manufacturing process reduces
polycarbonate out-gassing by employing a new heating process during
fabrication, which burns off a greater number of impurities before the
product cures. The heating process reduces out-gassing significantly
with below parts per billion (PPB) levels being achieved.
Applications: LEXAN LI1911R resin is designed for molding FOSBs and FOUPs. FOSBs protect bare 300mm silicon wafers.
Platform: In addition to high purity, LEXAN LI1911R resin also
offers outstanding impact strength, low haze, excellent color
consistency, and almost no particulates.
Availability: July 2004 onwards.
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Product Briefings 
