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24th Edition: The influence and measurement of airborne molecular contaminants |
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Oct 01, 2004 at 06:17 PM |
Caroline R. Ayre & Anurag K. Mittal, California Materials Technology Department, Intel Corporation,Santa Clara, CA, USA & Joseph F. O'Sullivan, Strategic Facilities Technology Development, Intel Corporation, Leixlip, Ireland
ABSTRACT
The control of airborne molecular contamination (AMC) concentrations in microelectronics' Fab air is critical to successful manufacturing. Outgassed contaminants can adversely affect many processes, including lithography, tool life and reduced long-term device reliability. Yet, in-Fab particle cleanliness levels may have actually decreased in recent years due to the use of front-opening unified pods (FOUPs) and integrated tool mini-environments in 300-mm manufacturing.
24th Edition: The influence and measurement of airborne molecular contaminants
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Cleanroom 
