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James Moyne, Brooks Automation, Inc.

ABSTRACT

Advanced process control (APC) capabilities such as “run-to-run control” are now required components of lithography system solutions. Unfortunately these control solutions, usually targeting overlay and CD control, have generally been developed from the ground up with non-standard APC automation strategies. The result is a lack of ability to incorporate capabilities such as robust and stable control solutions, intelligent metrology strategies, standardized equipment automation and software interfaces, and fab-wide multi-process solutions targeting electrical characteristics, throughput and yield. These issues are explored in this article, along with methods for achieving and quantifying Return On Investment (ROI), as well as a fab-wide coordinated strategy for APC deployment in lithography. It is argued in this article that a coordinated approach to lithography APC such as this will rapidly become a required component of effective APC deployment as we move to 32 nm and beyond.