Kelly Barry & Sanjay Yedur, Timbre Technologies, Inc., Santa Clara, CA, USA

ABSTRACT

Optical digital profilometry (ODP) has for years been implemented for the metrology of 2D (i.e., line-space) structures at various process levels, including lithography, etch, and CMP. ODP provides critical dimension, crosssectional profile, and film thickness information for both stand-alone and integrated metrology applications. ODP is now being implemented for metrology of 3D hole and island structures for both lithography and etch process development and monitoring.