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Home arrow Wafer Processing arrow Articles arrow Edition 26 arrow 26th Edition: Challenges and trends in copper plating
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26th Edition: Challenges and trends in copper plating Print E-mail
Jun 21, 2005 at 11:12 PM

Axel Preusse, AMD Fab 36 LLC & Co. KG & Markus Nopper, AMD Saxony LLC & Co. KG, Dresden, Germany

ABSTRACT

Ever since copper plating together with the dual damascene integration scheme established itself as the mainstream, filling of via-holes and trenches has been the focus of interest for process engineers as well as integration experts. 

26th Edition: Challenges and trends in copper plating technology for 90nm and beyond
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