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Product Briefing Outline: Nikon Instruments has introduced a new wafer loader NWL200 Series that is capable of loading wafers as thin as 100 micrometers. Using a new chuck system to transfer wafers, the NWL200 Series is claimed to achieve highly-reliable loading suitable for inspection of next-generation semiconductors. Previous systems could not be counted on to safely load wafers thinner than 300 micrometers, according to the company.

Problem: As advances in manufacturing processes have made wafers increasingly thin, safe wafer transfer has become essential, especially in the back-end microscope inspection process. Thin wafers often undergo significant distortion in the cassette, making it necessary for the position sensors to be accurate to avoid damage by the arm.

Solution: The optimized arrangement of the sensor beams in the NWL200 allows it to accurately detect the shape of the wafers in the cassette. Additionally, the optional edge-chipping detection function automatically detects wafer cracking. This enables macro inspections of all areas, adding to the support that was already available with earlier models. Ergonomic efficiency has been designed into every aspect of the system. Operation keys and knobs are located within easy reach of the operator and the wafer cassette is positioned to help ease load/unload of the cassette. The overall efficiency of the wafer transfer is claimed to reduce cycle time, achieving significant throughput improvements.

Applications: Inspection of wafers as thin as 100 micrometers.

Platform: The NWL200 features new wafer-slot buttons on the front panel that enable users to select a specific wafer in a slot with the touch of a button. At the same time, a large LCD screen allows operators to set conditions and check the operating status at a glance. Additionally, when the loader is connected to a LAN, users are able to program recipes and backup data from a PC.

Availability: July 2008 onwards.