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NexPlanar completes $14.5 million financing round to fund new CMP pad technology
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NexPlanar Corporation has announced its completion of a $14.5 million
round of financing that will enable them to market and commercialize
its new CMP pad technology. The company uses proprietary "nano-domain"
technology, which, according to the company, improves planarity,
across-wafer uniformity and the most advanced CMP applications.
The funding round, which was led by InterWest Partners, included the following investors: BlueRun Ventures, Smart Forest Ventures, Fina Ventures, Intel Capital and Entegris.
By Síle Mc Mahon