Online information source for semiconductor professionals

Evonik Industries AG and BASF have announced a joint development program for next-generation CMP slurries, targeting shallow trench isolation (STI) and inter-layer dielectric (ILD) processes. Evonik is to provide various grades of cerium oxide to be used with BASF’s slurry chemistry.

“With the introduction of smaller node sizes, the requirements of the CMP process have become increasingly critical to IC fabrication. Evonik and BASF believe that this project will enable both parties to stay ahead in the CMP technology and provide next generation solutions and materials for the IC industry,” said Dr. Iordanis Savvopoulos, Vice President of Technology Solutions in Evonik´s Business Unit Inorganic Materials.

“Combining BASF’s extensive background in chemistry and long years of experience in the IC industry with the expertise of Evonik in abrasive particles, we can provide intelligent solutions that meet the increasingly stringent requirements in the market,” said Dr. Klemens Mathauer, head of CMP business of BASF’s global business unit Electronic Materials.