Product Briefing Outline: Rudolph Technologies has
made available the AXi 940 macro defect inspection module. The new AXi
940 module will perform wafer frontside inspection as part of the
all-surface ‘Explorer’ Inspection Cluster - a multi-surface inspection
system designed to deliver fast, accurate and reliable macro inspection
at a low cost-of-ownership. The first Explorer Inspection Cluster
featuring an AXi 940 module is currently at a beta customer, and a
second unit is scheduled to ship in April 2008. The initial systems are
targeted primarily for high-volume production applications in advanced
lithography and CMP processes.
Problem: The AXi 940’s software is claimed to
significantly reduce the amount of time required for recipe creation by
automating many of the tasks and decisions that are normally done by
the tool operator. In addition, the all-surface Explorer Inspection
Cluster gives users the ability to take the AXi 940 module offline for
recipe creation while keeping all other modules in the cluster in
production. Previously, if one module had to be worked on, the entire
tool would have to be taken off-line.
Solution:
The AXi 940 is the culmination of over three years of software
development and incorporates the technological developments found in
the AXi and Waferview product lines. This convergence of technology has
resulted in improved macro resolution paired with a completely
redesigned software interface focused on reducing cost-of-ownership
through improved productivity and reliability, as well as reduced
dependence on human operators.
Applications: Macro defect inspection including CMP and lithography.
Platform: The
AXi series features a flexible and modular platform which enables
future upgrades for all-surface inspection. Bridge tool capability
facilitates inspection of 200-300mm wafers. It has multiple inspection
resolution flexibility with typical throughputs between 120-140 wph and
can detect defects as small as 0.5 microns.
Availability: January 2008 onwards.