Comment by GUEST on 2008-05-19 09:16:51
http://www.fabtech.org/content/view/6339/ tell other :) |
Comment by GUEST on 2008-04-18 11:34:31
Still way behind Intel. Intel announced their 32nm breakthrough last year. (http://www.intel.com/pressroom/archive/releases/20070918corp_a.htm?iid=tech_arch_32nm+body_pressrelease). Of course Intel has been doing High-K Metal gates for the last 2 to 3 years already (http://download.intel.com/intel/finance/presentations/pdf_files/bohr45nm.pdf). They never anounce real breakthroughs until they have already proven them manufacturable and ready for high volume production. IBM and AMD have great R&D groups that have proven track records of innovation, but Intel continues to beat the competition with their quick innovation-to-market (at high volume) approach, and I don't see anyone catching up to them in the near future. |
News 
IBM’s joint development partners that include Chartered Semiconductor, Freescale, Infineon, Samsung, STMicroelectronics and Toshiba Corporation - but not AMD in this case - have touted performance and low-power consumption results from 32nm high-k/metal gate (HKMG) test chips produced at IBM's East Fishkill, N.Y. 300mm fab. 