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Home arrow News arrow Cleanroom arrow Powerchip breaks ground on next two 300mm fabs
Powerchip breaks ground on next two 300mm fabs Print E-mail
Apr 08, 2008 at 05:10 PM

ImagePowerchip Semiconductor Corporation (PSC) has officially broken ground on its next two 300mm fabs, dubbed P4 and P5, at an estimated combined cost of approximately $8.2 billion. Each fab will have a capacity of 60,000 wafer starts per month (wspm) when fully ramped. 

Typically, cleanroom completion can be expected within 12 months and first phase tool install can be expected one to two months later. Initial production can be expected in the fourth quarter of 2009 at one of the facilities.

PSC said that the new fabs will use sub-50nm process technology to produce DRAM and NAND flash devices. PSC said that with the addition of the two new fabs it would become one of the top three manufactures in the memory market.
Readers' comments
Comment by GUEST on 2008-04-14 11:36:42
where are these fabs at?
Comment by GUEST on 2008-04-11 16:09:09
Where are they located?
Comment by GUEST on 2008-04-14 11:37:50
I was about to ask that. 
Checked on their site: Hsinchu Science Park in Taiwan.


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