Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT

The biggest manufacturing debate in the history of the semiconductor industry is upon us.
Unlike the transition from the 200mm wafer size to 300mm where there was eventually a general consensus from a major collection of IC manufacturers, equipment and support service suppliers as to the need for the transition, this is currently not the case with a potential move to 450mm. In this first of a multi-part series of articles planned, we discuss the drivers and the analysis undertaken by the team at International SEMATECH Manufacturing Initiative (ISMI) that lay the groundwork for what is now being hotly debated across the industry in respect to 300mm Prime and ultimately 450mm.