Mark Osborne, Editor-in-Chief, Semiconductor Fabtech

ABSTRACT

Continued pricing pressure in the both the NAND and DRAM markets in the second-half of 2007, has significantly disrupted new 300mm fab construction plans and further capacity ramps at existing facilities. A price war in microprocessors has eased though price competition has remained strong forcing AMD to revise plans to fit-out its converted 300mm facility Fab 38. As the year ended, capital expenditure plans for leading-edge manufacturers were becoming clearer with significant spending cuts projected for 2008 compared to 2006 & 2007. We discuss the impact this will have on 300mm fab activity in 2008 and review revised tool install schedules for 4Q07 and 2008 as a whole.