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New Product: Toppan Photomasks’ new DFM tool analyses defects and design errors |
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Mar 13, 2008 at 04:46 PM |
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Product Briefing Outline: Toppan Photomasks has introduced a new DFM tool that will shorten cycle time and reduce risk in chip design through an exception dispositioning process for identifying and analyzing defects and design errors. The tool was developed in collaboration with Anchor Semiconductor, Inc. and is an extension of that company’s ‘NanoScope’ DFM platform. It allows designers and tapeout engineers to review “exceptions” found during the processing of customer data and masks.
Problem: While photomask suppliers traditionally have provided their customers’ exception data for review, the typical report format limits the customers’ ability to analyze the defect in context with surrounding data. The additional work and associated uncertainty can delay customer release of the data for mask manufacturing.
Solution: Toppan’s new tool will provide customers this contextual analysis by utilizing the powerful geometric figure-handling capabilities of the Anchor NanoScope platform. Engineers will easily be able to determine the design or lithographic relevance of the exception in question and make informed decisions on whether to repair or waive the exception. In the case of MRC violations, the new tool also enables the engineer to review any “do not inspect regions” (DNIRs) proposed to resolve the MRC violations without correcting the pattern data.
Applications: Identifying and analyzing defects and design errors
Platform: The NanoScope platform enables a family of products covering a wide range of applications, include design hotspot identification, special RET and OPC, OPC verification, photomask inspection, silicon wafer printing and defect inspection.
Availability: February 2008 onwards.
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