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Entrepix extends Tempe facility

12 March 2008 | By Síle Mc Mahon | News > Wafer Processing

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EnteprixEntrepix, Inc. has quadrupled its cleanroom space at its Tempe, Arizona facility with the addition of a 5,000 square foot facility to contain the company’s extended equipment and services. Increased demand for CMP-related services has meant that the company’s current facility size was unsuitable and merited an expansion. 

In addition to the extra cleanroom space, the Entrepix facility will now house a showroom for refurbished CMP and metrology equipment, a class 10,000 space for the refurbishment of post-CMP cleaners and an increased capacity for CMP processing.

“Over the past year the industry has increasingly recognized that the majority of semiconductor manufacturing is still done at 90nm and larger technology nodes on 200mm or smaller wafers,” said Tim Tobin, President and CEO of Entrepix. “Now called ‘mainstream semiconductor manufacturing’ or sometimes the ‘More than Moore’ segment, this year’s ITRS noted that the industry is at an inflection point, and recognized the divergence of mainstream and leading-edge manufacturing. Naturally, this creates a market demand to develop equipment, processing and technology solutions that will support long-term utilization of the very cost effective mainstream semiconductor manufacturing platforms.”

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