Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow News arrow Critical Components & Sub-Systems arrow Entegris buys into poly silicon products company IMI
Entegris buys into poly silicon products company IMI Print E-mail
Mar 06, 2008 at 02:57 PM

ImageEntegris has said that it has spent $8 million on a 14 percent equity stake of privately held Integrated Materials, Inc. (IMI), which specializes in poly silicon-based components, in particular for semiconductor diffusion furnaces. The agreement will also allow Entegris to purchase the remaining equity of IMI upon completion of certain closing conditions, according to the company. 

"The access to IMI's breakthrough materials technology dovetails with our focus on improving the productivity of our semiconductor customers by controlling contamination in their manufacturing process,” commented Gideon Argov, President and CEO of Entegris. “IMI's unique, consumable solution, which uses a poly silicon material to significantly reduce particle contamination and improve yields, extends our wafer handling business and material science expertise."
 
The deal will enable IMI to leverage worldwide sales and service operations of Entegris, which is expected to improve its business potential.
Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
Entegris expands market opportunities with Poco Graphite acquisition  (14/07/2008)
Chartered extends R&D pact with IBM to cover 22nm bulk CMOS   (02/04/2008)
Entegris starts Malaysian manufacturing site expansion  (22/03/2006)
Entegris sells non-core MFC & gas delivery line to Celerity  (07/02/2006)
Entegris wins 20mm carriier order from Singapore  (04/02/2005)

Related jobs
Director, Back End Equipment Engineering at DayStar Technologies  (Newark, 18/07/2008)
Applications Engineer  (Austin, 10/06/2008)
Senior Component Design Engineer  (Intel Shannon, Co Clare, Ireland, 19/03/2008)
Ingenieur Conception analogique/mixte Power Management   (Toulouse, 19/02/2008)
Process Engineer III  (Santa Clara, 12/11/2007)
300mm