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New Product: CMP pad for 65nm copper barrier’s |
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Sep 12, 2005 at 06:04 PM |
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Rohm and Haas
Electronic Materials has launched the "VisionPad" VP3100 CMP pad which it
claims to be the industry's first to combine the benefits of hard and
soft pads for advanced CMP applications at the 65nm node. The VP3100 pad is
currently in production at Asian foundries and a European device manufacturer
and will be commercially available in January 2006.
"As customers
move toward 65nm node device production, they're experiencing yield losses from
defects that were once tolerable. The VisionPad VP3100 polishing pad responds
to this challenge by offering a low defectivity pad with superb planarization
characteristics in the copper barrier step," said Cathie Markham, vice
president, Technology, Rohm and Haas Electronic Materials, CMP Technologies.
The VisionPad VP3100 polishing pad is the
first offering in the company's new VisionPad CMP polishing pad series. The
VisionPad VP3100 polishing pad's proprietary polyurethane formulation provides
a softer surface than a traditional hard pad to reduce defects while
maintaining the rigidity needed to deliver good planarization during CMP in
copper barrier processes, the company claims.
Unlike soft
pads typically used in this application, the VisionPad can be conditioned,
allowing pad surface regeneration to achieve optimal polishing results that are
constant throughout the pad's life as well as from pad to pad. Although
targeted for 65nm applications, the VP3100 CMP pad has the ability to backfill
into current 130nm and 90nm processes, the company confirmed.
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