ANGSTREM is to convert and existing fab to 200mm wafer production with
the construction of support buildings and full conversion expected to
be completed by the end of 2009. M+W Zander FE GmbH has been awarded
the contract that is expected to cost approximately €150 million.
“After successful completion of the design phase, we are very pleased
that ANGSTREM-T chose M+W Zander as their partner for the turn-key
construction of the new and modern semiconductor factory,” Jürgen Wild,
Speaker of the M+W Zander Management Board. “Overall, we regard the
Russian market as extremely dynamic for our future business.”
The
new ANGSTREM-T fab located in Zelenograd, Russia, will have a cleanroom
of about 6,000 square meters and employ 180nm through 130nm process
technologies, primarily on a foundry basis. ANGSTREM had previously
purchased used 200mm equipment from AMD.