A major semiconductor manufacturer has selected a single wafer cleaning
system dubbed ‘ORION’ from FSI International, which has yet to be
officially announced. The tool will be used for 32nm BEOL cleaning
processes that specifically handle low-k materials.
“We have taken a very deliberate approach in the development of our single wafer cleaning technology, focusing on translating our considerable experience and expertise into a tool that will meet the industry’s advancing requirements,” commented Don Mitchell, FSI chairman and CEO.