Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow News arrow Fab Management arrow Chartered Semiconductor reduces capex but boosts 300mm fab capacity in 2008
Chartered Semiconductor reduces capex but boosts 300mm fab capacity in 2008 Print E-mail
Feb 01, 2008 at 04:00 PM

ImageChartered Semiconductor said that capital expenditure for 2008 would be approximately $630 million, compared to $758 million in 2007. The majority of spending will be focused on accelerating the ramp of its 300mm facility, Fab 7, especially for 65nm bulk and SOI volume production. 

The Singapore foundry said that it expects to reach 30,000 wafer starts per month capacity capability by the end of 2008, indicating the potential for a quarterly increase of approximately 10 percent in the year.

Capacity for 90nm and below technologies is expected to represent approximately 23 percent of total capacity by December 2008, the company said.

Image 


Readers' comments



Bookmark with:
DeliciousDiggredditStumbleUpon

Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter

Related articles
TSMC capital spending up for 2Q08  (30/04/2008)
Fab utilization rates continue to climb at Chartered Semiconductor  (25/04/2008)
SanDisk reveals increased capital spending through 2010  (28/02/2008)
Qimonda cuts capex and boosts R&D spending  (12/11/2007)
TSMC ramping 300mm fabs aggressively  (26/04/2007)

Related jobs
Equipment Engineer  (Richmond, 15/10/2007)
Design Engineer Manager  (Williston, 15/10/2007)
Product Engineer - Design Analysis & Characterization  (Williston, 15/08/2007)
Product Engineer - Design Analysis & Characterization  (Williston, 15/08/2007)
Design Engineer  (Williston, 15/08/2007)
Download
Subscribe
300mm