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Product Briefing Outline: Rohm and Haas Electronic Materials’ CMPTechnologies division has introduced the ‘VisionPad’ 5000 CMP pad, specifically designed for defectivity reduction in shallow trench isolation (STI) and interlayer dielectric (ILD) applications. The new pad targets volume manufacturing of memory and logic chips at 65nm and below.

Problem: The mechanics of STI scratch defects during CMP are directly related to the interaction of materials at the interface of the pad with the wafer surface. To address this issue, Rohm and Haas developed the VisionPad 5000 with an optimized polymer and pore structure designed to improve the robustness of STI CMP processes. In addition, the VisionPad 5000 is claimed to achieve a 50 percent reduction in CMP-induced scratch and chatter marks over current materials. The pad is designed to produce improved results in overall planarization and when coupled with ceria-based polishing slurries, the removal rate is also enhanced.

Solution: The VisionPad 5000 features an advanced polymer specifically designed by CMP Technologies to lower defectivity on all types of commercial slurries.  To achieve lower defectivity with good planarity, the VisionPad 5000 uses an energy absorbent polymer in a unique formulation. It has demonstrated performance factors that are equal to the industry standard IC1000 pad – including removal rate, dishing, erosion, process window and planarity - while reducing defectivity by at least 50 percent. Other features include a long pad lifetime and multiple grooving, sub-pad and adhesive configurations. Polishing and conditioning recommendations are also offered by Rohm and Haas. The VisionPad 5000 pads offer predictable pad-to-pad performance and stable operation throughout the process, according to the company.

Applications: Shallow trench isolation and interlayer dielectric polishing steps.

Platform: All VisionPad products are manufactured using stringent SPC/SQC methods.  VisionPad products will be manufactured and supported in Rohm and Haas’s new facility in Taiwan as well as the Company’s existing manufacturing site in the United States.

Availability: January 2008 onwards.