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New Product: New ‘Producer eHARP’ SACVD system from Applied meets 32nm STI gap-fill requirements
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Product Briefing Outline: Applied Materials is now
offering the ‘Producer eHARP’ (enhanced High Aspect Ratio Process)
system that extends the ‘HARP SACVD’ gap-fill technology for critical
STI device structures to 32nm and beyond. The eHARP process has been
developed to produce void-free films to fill <30nm, >12:1 aspect
ratio features that are seen as being essential for the fabrication of
advanced memory and logic devices. The eHARP process features new
proprietary process innovations to enable high-density, strain-inducing
films enable the scaling of conventional planar and emerging 3-D device
structures.
Problem: Applied offers customers an STI gap-fill
roadmap beyond 32nm without significant changes to their process flow.
Using a new non-plasma based CVD (chemical vapor deposition) oxide
film, eHARP is aimed at addressing the stringent gap fill requirements
for STI unit processes at next-generation geometries.
Solution:
The new eHARP film improves upon the first-generation HARP film gap
fill capability by introducing water vapor to the TEOS/ozone chemistry
during the deposition process. This results in a more tightly packed,
denser film that enables seamless, void-free gap fill in features with
aspect ratios >12:1. eHARP technology is claimed to offer the
lowest overall cost-per-wafer compared to non-CVD gap-fill
technologies. Virtually carbon-free, the eHARP film requires no
protective liners or capping layers, easily integrates with
conventional CMP processes and provides reliable, robust device
isolation. In addition, the eHARP system’s proven process chemistries
do not generate hazardous liquid byproducts that would necessitate
specialized chemical disposal.
Applications:
The eHARP process is designed for conventional planar and emerging 3-D
device structures that can require void-free films to fill <30nm,
>12:1 aspect ratio features.
Platform: The
eHARP process is available on Applied’s acclaimed Producer platform,
which is used by virtually every chip manufacturer for advanced
applications including etch, low-k deposition, strain engineering,
litho-enabling films, PECVD and SACVD. More than 500 Producer systems
have been shipped to customers for SACVD applications, any of which can
be upgraded to run the eHARP process.
Availability: July 2008 onwards.
