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Rapid thermal processing of Cu/low-k interconnections for 65-nm technology node and beyond
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R. Singh, A. Venkateshan, & K. F. Poole, Holcombe Department of Electrical and Computer Engineering, Clemson University, Clemson, USA
ABSTRACT
In this article we describe the advantages of lamp-based RTP systems for thermal processing of Cu/low-k metallization at 65-nm nodes and beyond. The spectrum of incoherent light sources plays an important role in the design of RTP systems. As compared to furnace processing, mini-furnaces and resistiveheater- based RTP systems, lamp-based RTP systems provide less process variation that leads to reduced cost of the design and improved performance, reliability, and yield of advanced semiconductor products.
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