Numonyx and Hynix have entered into a five-year agreement to develop
next-generation NAND flash memory, which extends the level of
collaboration previously undertaken, which includes 300mm fabrication
at Hynix facility in Wuxi, China. The cost sharing deal includes
product design, process development and packaging, such as multi-chip.
One of the key markets being addressed is Solid State Drives (SSD).
“To become successful in the rapidly evolving semiconductor
industry, addressing technology issues jointly rather than
independently reduces the risk by leveraging the best of both
companies,” said Jong-Kap Kim, Chairman and CEO of Hynix. “Future joint
technology development will be the key success factor in our alliance
and we expect to make significant progress in developing memory
solutions by focusing on the introduction of new products through
systematic co-development in product, software and controller areas.
Together, Hynix and Numonyx will develop a complete range of products
on leading edge technologies that will enable both companies to win in
the NAND segment. We’ll now have one of the broadest NAND design
communities in the world and we look forward to continued success as we
now work to develop new NAND memory solutions today and in the future.”
“Success and growth in the NAND segment over the next five
years will require a unique set of capabilities that we believe we can
achieve with Hynix,” said Brian Harrison, president and chief executive
officer at Numonyx. “By combining our expert resources, engineering
activities and Hynix’s absolute focus on driving cost, we believe we’ll
have leading-edge technology, cost-effective and scalable
manufacturing, industry leading memory system “know-how” and a history
of bringing system-level NAND solutions to market very quickly. The
complementary expertise from Hynix will certainly help strengthen our
NAND position in the wireless segment in particular.”
Both companies are to develop new NAND flash products based on Numonyx’s Charge-Trapping process technology.