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Rudolph Technologies strengthens position in 3D bumped wafer inspection |
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Jan 23, 2008 at 03:08 PM |
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 Rudolph Technologies has strengthened its position in the 3D bumped wafer inspection market, which is expected to grow at a CAGR of 27 percent through 2010, according to TechSearch, with the acquisition of intellectual property and selected assets of RVSI Inspection. Terms of the transaction were not disclosed.
Rudolph said that it would maintain a technology center for the wafer scanner products at RVSI’s Hauppauge, NY, headquarters but will relocate the associated manufacturing activities to Rudolph’s Inspection Business Unit in Bloomington, Minnesota.
“This purchase, as well as our recently-announced acquisition of Applied Precision’s probe card test and analysis business, was orchestrated to enhance our position as a dominant supplier of inspection and metrology solutions for an increasing number of back-end applications,” commented Paul F. McLaughlin, Chairman and CEO of Rudolph.
“We will be adding an excellent technical team to our Rudolph organization, and expect to quickly and efficiently fold the RVSI operations into our existing inspection business,” said Nathan Little, Executive Vice President and General Manager of the Inspection Business Unit. “With a high level of customer overlap, combined with our existing global applications and service support network, our goal is to make this transition as seamless as possible.”
The company will now be able to offer 3D bumped wafer inspection in the form of RVSI’s WS-3800 system as well as Rudolph’s 3Di Inspection System and the NSX 2D macro defect inspection system for a wide range of bumping applications.
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