Online information source for semiconductor professionals
Rohm and Haas adds capacity at Taiwan CMP production facility
Popular articles
Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008
Numonyx to close California Technology Center - 12 August 2008
Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008
Micron close to Inotera share purchase, says Gartner - 06 October 2008
Applied Materials sees higher CapEx spending for 2009 - 15 August 2008
Rohm and Haas Electronic Materials’ CMP Technologies arm is to
further invest in expanding its production capacity to meet growing
demand, the company said. The new facility only became operational in
March 2007 for CMP pad finishing processes. Complete pad manufacturing,
including casting operations for its ‘VisionPad’ and its ‘IC1000’ AT
pad series, will be operational in early 2009.
“Our Hsinchu Facility offers world-class, high-volume manufacturing
capability for leading-edge pad technology, including our newest
VisionPad and IC1000 AT pads for the most advanced manufacturing
nodes,” explained Sam Shoemaker, President of Rohm and Haas Electronic
Materials, CMP Technologies. “The conversion to Hsinchu supply has been
smooth and faster than originally anticipated. Customer qualifications
of the facility are going extremely well, and we are well ahead of our
original capacity expansion schedule.”
The company now expects to employ over 200 people at the facility by the end of 2008.