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Fujitsu breaks-out semiconductor division into new subsidiary |
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Jan 21, 2008 at 03:58 PM |
 After much rumor and speculation and a long-term study internally, Fujitsu Limited has decided to reorganize its ‘LSI’ semiconductor division with leading-edge development and production consolidated into its 300mm facilities in Mie Prefecture and a separate subsidiary established to run the operations.
Key to the reorganization is the move to a new business model for the division, which will now be able to collaborate as a strategic business partner with internal (Fujitsu Group) as well as external partners, yet to be revealed. The reorganization is scheduled to be implemented in March 2008, which will also see the fab equipment from its 200mm Akiruno TC facility moved to the Mie 200mm fab as well as process development for the 45nm node and below.
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Fab management 
