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Home arrow Critical Components arrow Articles arrow Edition 18 - Published March 2003 arrow 18th Edition: Using computational...
18th Edition: Using computational fluid dynamics analyses to support design and improvement of... Print E-mail
Mar 21, 2003 at 02:58 PM

Charles Ortloff, CTC/United Defense, Santa Clara, California, USA

ABSTRACT

Erosive wear in slurry delivery circuitry is a source of particulate matter that may add contaminants into CMP processing streams. Using wear reduction methods developed from the oil and gas industries for piping networks, methods to predict and mitigate erosive wear are described that have application to fluid circuitry used for FAB applications

18th Edition: Using computational fluid dynamics analyses to support design and improvement of semiconductor tools and components for deposition, etching, cleaning and rinsing
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