Home
News
Blogs
Fabtech Jobs
Product Briefings
Going Places
300mm Activity Reports
Core Sections
Wafer Processing
Lithography
Fab management
Materials & Gases
Critical Components
Cleanroom
EHS
 
Find

GlobalSpec - The Engineering Search Engine
 
Home arrow Critical Components arrow Edition 18 - Published March 2003 arrow 18th Edition: Advanced technologies in CMP slurry sys...
Critical Components News   RSS Feed
Entegris opens office in India to support PV and microelectronics businesses  02 Jul 2008
SAES Getters to acquire Memry Corporation  24 Jun 2008
Celerity establishes new facility in Singapore  28 May 2008
VLSI Research lists Top Ten critical subsystems suppliers for 2007  12 May 2008
Swagelok acquires semiconductor hose specialist Coreflex  16 Apr 2008
BASF Names Swagelok as a Global Preferred A-Supplier   02 Apr 2008
Entegris buys into poly silicon products company IMI  06 Mar 2008
Asyst offers 64-bit implementation of SECS/GEM tool connectivity products  28 Jan 2008
Dutch conglomerate acquires Integrated Dynamics Engineering  08 Jan 2008
Critical Components Product Briefs   RSS Feed
New Product: GF Piping Systems’ Type 567 Butterfly Valve improves wear for multiple applications  14 May 2008
Product Briefing Outline: GF Piping Systems has introduced the new Type 567 Butterfly Valve in large diameter sizes up to 12 inches.  The new corrosion-resistant valve incorporates a double eccentric  Read More
New Product: Nexen’s Roller Pinion System handles long run linear motion control  13 Mar 2008
Product Briefing Outline: A unique Roller Pinion System (RPS) from Nexen Group, Inc., allows machine designers to incorporate highly accurate linear and rotary motion-control functions with zero backlash and speeds  Read More
New Product: Entegris offers ‘Torrento’ high-flow liquid filters for wet etch and clean processes  17 Dec 2007
Product Briefing Outline: Entegris has introduced the new Torrento family of high-flow liquid filters that help improve liquid contamination control of nano-scale particles in wet etch and clean (WEC) manufacturing  Read More
18th Edition: Advanced technologies in CMP slurry systems reduce wafer damage Print E-mail
Mar 21, 2003 at 02:41 PM

Scott Robichaud & Katsuhiro Ohnishi, Asahi

ABSTRACT

Chemical Mechanical Planarization (CMP) slurry systems have created many new challenges in the semiconductor fabrication industry.
Certain types of CMP slurries consisting of suspended solids in solution are abrasive, and traditional components used in wet process
systems, such as diaphragm valves, can damage these slurries.

18th Edition: Advanced technologies in CMP slurry systems reduce wafer damage
Readers' comments


Bookmark with:
DeliciousDiggredditStumbleUpon
Visit Fabtech Jobs websiteSubscribe to Fabtech weekly newsletter
Related articles
18th Edition: Manufacturing productivity continuous improvement programmes  (21/03/2003)
18th Edition: Slurry metering for CMP  (21/03/2003)
18th Edition: Suppliers of critical subsystems make significant contributions to productivity and...  (21/03/2003)
18th Edition: Progress and challenges in PFC  (21/03/2003)
18th Edition: Photoresist issues for sub-100nm lithography  (21/03/2003)
Related jobs
IC Failure Analysis Engineer  (Los Angeles, 31/01/2008)
ATPD Process Integration Manager  (Portland, 22/11/2007)
System Design Engineer  (Silicon Valley , 14/09/2007)
Principal Engineer   (San Jose, 05/09/2007)
Senior System Design Engineer  (Milipitas, 09/08/2007)
Subscribe
300mm