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Home arrow Critical Components arrow Articles arrow Edition 35 arrow 35th Edition: Evaluation of process and cleaning chemist...
35th Edition: Evaluation of process and cleaning chemistry with vacuum for semiconductor and flat... Print E-mail
Sep 18, 2007 at 11:52 AM

 

Sang Hyun Park, Oerlikon Leybold Vacuum, USA

ABSTRACT 

It is remarkable that vacuum-based processes used to produce low density/large scale devices have also been used for controlling and making devices in high density processes utilizing some of the smallest scales humans have ever made.  People involved in science, materials, semiconductor, flat panel displays (FPDs), and research and development have preferred the use of vacuum processes to non-vacuum processes, the advantages of which are outlined below. There are different ways to analyze processes at process chambers and along vacuum lines depending upon your point of interest.  The general approach will be to look at the materials point of view (chemistry of materials), control of energy point of view and vacuum point of view to better understand the process characteristics that will result in improved tool uptime.  Depending upon the purpose of your process analyses, one aspect can be more important than the rest.  This article will be focused on how to evaluate the chemistry and materials of processes and cleaning with vacuum at the chamber(s) and along vacuum lines.

35th Edition: Evaluation of process and cleaning chemistry with vacuum for semiconductor and flat...
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