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In a new report from materials specialist market research firm Linx Consulting, the global market for CMP slurries and pads hit a record $1.2 billion in 2007 and is projected to reach $1.7 billion in 2011.

Growth is being spurred by technology node migrations and the eventual move by DRAM and NAND flash memory manufacturers adopting copper over aluminum for interconnect will see memory accounting for about 20 percent of the total CMP operations in 2007 and increasing to about one third of all CMP operations in 2011.

"Increasingly both DRAM and Flash will account for a higher proportion of wafer starts as the industry progresses from 90nm to 32nm technology nodes,” noted Mark Thirsk, Managing Partner at Linx Consulting.  “This coupled with the simultaneous conversion to copper of both DRAM and Flash will help to continue to drive CMP growth."
 
The market research firm expects both Samsung and Hynix to ramp copper for 55nm half pitch devices soon, followed by Qimonda, Elpida, Nanya and Inotera all converting to copper. A significant portion of Flash manufacturers will also integrate some level of copper over the same period.

"In 2008, about one-half of all CMP operations will be for devices produced at design rules of 90 nm and below," notes Mike Corbett, Managing Partner at Linx Consulting. "By 2011, almost 70 percent of all CMP operations will be done on devices at 90nm and below."

"Consumable suppliers who have had product success with 90 and 65nm processes will continue to realize strong revenues throughout the forecast period," according to Corbett. "In addition, suppliers who are winning at 45nm today will start to show strong revenue benefits in 2009/10 timeframe."

Rohm and Haas remains the leading supplier of CMP consumables, with an estimated 44% market share, followed by Cabot Microelectronics.