Jeffrey D.Williams, Dept. of Defense, Ft. George G. Meade, MD, USA

ABSTRACT

Gases which have been used in the semiconductor industry are now being regarded as having serious environmental concerns. Aggressive programs are being developed to phase out and eliminate these gases, collectively known as PFCs. As a result,
 alternative gases are being sought for the applications of chamber cleaning and wafer etch. A number of alternatives have emerged for both applications, and their performance and properties are discussed.