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Using computational fluid dynamics analyses to support design and improvement of semiconductor tools
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Charles Ortloff, CTC/United Defense, Santa Clara, California, USA
ABSTRACT
Erosive wear in slurry delivery circuitry is a source of particulate matter that may add contaminants into CMP processing streams. Using wear reduction methods developed from the oil and gas industries for piping networks, methods to predict and mitigate erosive wear are described that have application to fluid circuitry used for FAB applications
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