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UMC establishes 22nm node R&D partnership with SEMATECH
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UMC has joined the SEMATECH research consortium to partner on
22nm-and-below process technologies. UMC previously partnered with
SEMATECH’s former subsidiary, ATDF, in 2006 that saw the companies
carry out pre-production work on 45nm and 32nm technologies such as
dual work function metal gates, and mobility enhancement structures.
“Partnering with SEMATECH is a win-win situation for both
organizations,” said Dr. Shih Wei Sun (pictured), CEO of UMC. “The
combination of UMC’s 300mm manufacturing experience and process
technology expertise and SEMATECH’s wealth of knowledge in the field of
semiconductor R&D will help the industry better handle the
challenges of migration to next generation processes. We are excited
about SEMATECH’s commitment to 300mm exploratory research and
development and look forward to passing the benefits of this technology
relationship to our customers.”
SEMATECH
President and CEO Dr. Michael Polcari said, “Our members join me in
welcoming UMC to SEMATECH and we look forward to their contributions
and technical insight from their perspective as a global leader in
300mm foundry services. UMC will be an important partner in
accelerating the progress of R&D innovations into manufacturing
solutions.”
In May 2007, UMC opened a new dedicated 300mm
R&D center staffed with over 1,000 employees to tackle next
generation process technology challenges.