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Home arrow Blogs arrow Editor's Blog arrow Blogged arrow TSMC makes big push in 300mm capacity, UMC not responding
TSMC makes big push in 300mm capacity, UMC not responding Print E-mail
Aug 01, 2005 at 05:26 PM
Not that many years ago TSMC and UMC played a real game of constant one-upmanship. Not anymore—if last weeks chalk and cheese financial results have anything to do with it!

A stark difference in both leading foundries going forward can be seen in the two companies ramp rates for 300mm wafer starts per month (wspm). Only two years ago UMC held a slight lead in 300mm wspm, thanks primarily to Xilinx, UMC's largest customer.

But things have changed steadily in that time with TSMC finishing 2004 with a slight lead over UMC in the 300mm wafer capacity stakes of only about 4,000wspm. However, current forecasts from both companies for wspm by the end of the year are drastically different.

Part of reason is the contrast in capital expenditures for 2005. UMC has drawn in its spending to that of $ 1 billion US dollars, while TSMC plans to spend $ 2.5 billion US dollars this year. Interestingly both foundries currently have two 300mm fabs in operation. Some of the capex difference could be explained away by the fact that TSMC has more fabs than UMC overall and is also aggressively ramping its new 200mm fab in China. But, according to both companies financial data for the last quarter the vast majority of the planned capex is earmarked for 300mm fab expansion.

Based on the ramp rate projections from both foundries TSMC will be significantly ahead of UMC by the year-end. TSMC's Fab12 had a capacity of 25,000wspm, however by 3Q05 will be handling 40,000wspm! No not a mistake, just the fact that TSMC has forgotten to tell everyone that it has been tool installing in "Phase II" of Fab12 most of this year. Fab 14 its second 300mm fab started ramping in the 3Q04 and should reach just over 15,000wspm in the 3Q05. TSMC would have just shy of 56,000 300mm wspm in operation.

In contrast UMC has not been ramping as aggressively. Both its Fab12a and Fab 12i (Formerly UMCi, Singapore) will only increase wafer starts by about 2,000wspm throughout 2005. That means that after 3Q05, UMC does not expect any increase in wafer starts for the remaining quarter in the year. Fab12a will have reached 22,666wspm by 3Q05 and Fab12i will be at 14,000wspm.

The difference really sticks out when you add up the totals. Going into the 4Q05 TSMC will be achieving 56,000wspm while UMC will have settled for the rest of the year on 36,500wspm, nearly a 20,000wspm difference.

The only saving grace for UMC right now is that Chartered has just started 300mm shipments from Fab 7, while SMIC is struggling to qualify its 300mm fab in China for both Infineon and Elpida. But both 300mm fab newbies, will be looking long and hard over the next 12 months at UMC's position. As for TSMC, it looks like they are long gone.


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