Online information source for semiconductor professionals

Blank check company and metrology tool firm Negevtech merge

07 March 2008 | By Síle Mc Mahon | News > Wafer Processing

Popular articles

Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008

Numonyx to close California Technology Center - 12 August 2008

Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008

Micron close to Inotera share purchase, says Gartner - 06 October 2008

Applied Materials sees higher CapEx spending for 2009 - 15 August 2008

NegevtechIsrael Growth Partners Acquisition Corporation (GPAC), an Israeli blank check company, is to take control of Israel-based metrology firm Negevtech.  Following the transaction, Negevtech will have access to approximately $55 million currently held in IGPAC's trust account.  Approximately $11 million will be used for working capital and to repay some of Negevtech’s indebtedness. IGPAC CEO is Carmel Vernia, former Chairman and CEO of Tower Semiconductor. 

"We are happy to join forces with IGPAC; the merger will enable us to drive market penetration of our recently introduced 3300 product line which is gaining strong acceptance with customers worldwide,” said Dr. Rivi Sherman, President and Chief Executive Officer of Negevtech. “Furthermore we are eager to accelerate the development of our next generation inspection system which holds great promise for the company's future.”

“The coupling of Negevtech's innovative technology and industry presence, with IGPAC's access to capital will create superior conditions to expand Negevtech's customer base and product offering," commented Carmel Vernia, Chief Executive Officer of IGPAC.

Related jobs

Factory Start Up Director/Manager (Solar Factory Operations) - Applied Materials - , 07 August 2008

Final Test Engineer - Axcelis Technologies - Beverly, 14 August 2007

Software Engineer - Tokyo Electron Limited - Santa Clara, 10 August 2007

Electrical engineering - Axcelis - Beverly, 10 August 2007

Senior Applications Engineer - Axcelis - Beverly, 09 August 2007

Related articles

New Product: Pixer enables high speed, high resolution DUV metrology of mask blanks - 21 February 2008

New Product: Negevtech upgrades defect sensitivity in its Argus 3200 inspection tool - 10 May 2007

Atomic Force Profilometry for Chemical Mechanical Polishing Metrology - 01 March 2000

Nanometrics enters photovoltaics market with acquisition of Tevet - 08 May 2008

ODP for post-lithography metrology of 3D structures - 01 March 2005

Reader comments

No comments yet!

Post your comment

Name:
Email:
Please enter the word you see in the image below: