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Next generation retaining ring materials for CMP tools |
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Oct 08, 2004 at 01:00 PM |
Product Briefing Outline: Quadrant Engineering Plastic
Products has launched longer production life chemical mechanical
planarization (CMP) retaining rings. "Semitron" CMP LL5 and "Semitron"
CMP XL20, offer claimed service life up to 20 times greater than
materials currently used to make retaining rings. The materials are
available in stock shapes specifically for precision-machined parts for
critical tolerance CMP applications.
Problem: The need to develop ongoing improvements in materials
that extend production life and reduce costs of CMP retaining rings.
Semitron is claimed to reduce the cost of currently-used polyphenylene
sulfide (PPS) consumable rings by half and improve production life by a
factor of 20 or more, depending on the material and the process
environment.
Solution: Semitron CMP LL5 is an enhanced polyester. Laboratory
simulations show that it extends retainingring life by as much as 5
times over rings made of PPS, depending on process conditions. It is a
lower cost alternative to PPS and suitable for use in all CMP processes
and is claimed to be ideal for use in ring designs that have steel or
ceramic reinforcement. Semitron CMP XL20 is a modified polyamide-imide.
It is claimed to consistently outlasts all other engineering plastics
in all major process environments and, compared to PPS, lasts up to 20
times longer. Semitron CMP XL20 has the optimum combination of long
life in use and mechanical properties needed in demanding process
environments. It outperforms other retainingring materials, including
acetal (POM) and polyester (PET) with its higher stiffness, tighter
retention of critical tolerances and broader resistance to polishing
media and process chemicals.
Applications: Major uses include bearing and wear components.
Platform: Quadrant EPP's machining stock shape products range
from Nylatron® nylons and Acetron® acetal to ultra-high performance
polymers that resist temperatures over 800° F (425°C).
Availability: July 2004 onwards.
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