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Copper electroplating gets finer filters |
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Oct 08, 2004 at 04:00 PM |
 Product Briefing Outline: Pall Corporation is introducing its
"Varafine Varaclean" Copper Electroplate Technology (CET) Series Filter
Cartridges. This is a new family of filters specifically designed to
reduce defects and improve productivity in high-volume copper plating
processes. The new filters represent an important advance in the
semiconductor industry's move to mainstream manufacturing of copper
devices across more product types.
Problem: The need for advanced filtration in copper
electroplating processes is expected to grow as copper devices move
into mainstream manufacturing. The need to address contamination
control challenges in next-generation applications with novel chemical
filtration technologies without affecting productivity.
Solution: The Varaclean CET filter cartridges are based on
Pall's asymmetric membrane material, a patented technology that boosts
filtration performance in volume manufacturing. The membrane filter is
compatible with copper plating chemistries, including advanced
additive packages used to enhance the copper plating process. The
proprietary membrane technology filters impurities down to
50nanometers(nm) while maintaining exceptionally high flow rates, a key
requirement for meeting defectivity targets in manufacturing at the
65nm technology node.
Applications: Currently in use on 200mm and 300mm copper electrochemical deposition (ECD) tools from major equipment manufacturers.
Platform: Varaclean CET filter cartridges are available in
multiple sizes and grades, all of which offer greater than 99.9 percent
removal efficiency.
Availability: July 2004 onwards.
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Critical Components 