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Harsh duty dry pump for fluorine process |
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Oct 08, 2004 at 11:00 PM |
 Product Briefing Outline: BOC Edwards, has introduced a new variant of
its "iH" harsh duty vacuum dry pump to provide even longer overhaul
intervals and increased safety in fluorine processes.
Problem: iH Series pumps are designed specifically for difficult
semiconductor processes such as PECVD and LPCVD used for wafer and flat
panel display manufacturing that produce unwanted by-products or
corrosion. They have several advantages over traditional semiconductor
vacuum pumps, among them better dust handling, less condensation, lower
power usage, smaller size and longer life before overhaul.The iH-F
variant has new features to enhance safety, reduce the effects of
corrosion, and reduce the cost of ownership.
Solution: The iH Series uses a single stage roots mechanism
booster pump mounted above the base drypump. It is designed to handle
harsh process applications and is available in 600, 1000 and 1800m3h-1
variants. All pumps have highly efficient and totally enclosed
water-cooled motors. The iH160 and iH1800 drypumps have been
specifically designed for high flow 300 mm processes. All iH-F variants
include an innovative sensing system to detect seal deterioration
inside the pump which allows the user to operate the pump for longer
while maintaining confidence in seal integrity.
Applications: iH Series Drypumps provide for high reliability
and low cost of ownership for difficult processes such as Low
Pressure/Plasma Enhanced Chemical Vapor Deposition (PECVD & LPCVD)
where particulate, condensable and corrosive by-products are present.
iH-F variants are available in a range of peak speeds from 80 to
1800m3h-1.
Platform: Upgrades to many current iH pumps are available from
BOC Edwards' global service network. Pump display terminal is a
hand-held module located at the front of the pump, which allows simple
local monitoring and control.
Availability: July 2004 onwards.
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Product Briefings 
