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22nd Edition: Real-time profile control: advanced process control for copper CMP |
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Jul 18, 2004 at 02:47 PM |
Doyle Bennett, Jimin Zhang, Bogdan Swedek, Jeff David & Manush Birang, Applied Materials and Dick de Roover, SC Solutions
ABSTRACT
Real-time profile control (RTPC™) has been implemented for 300-mm copper CMP via closed-loop control of bulk copper removal, on a withinwafer (WIW) basis. The method uses a high-resolution sensor to measure the copper thickness across the wafer during polishing (in situ). The bulk copper-removal process is controlled via incremental changes to polishing conditions in situ, real-time using a multi-zone polishing head, the Titan Profiler™.
22nd Edition: Real-time profile control: advanced process control for copper CMP
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Fab management 
