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Home arrow News arrow Wafer Processing arrow High-voltage 180nm technology in production at TSMC
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High-voltage 180nm technology in production at TSMC Print E-mail
Feb 04, 2005 at 04:00 AM
Taiwan Semiconductor Manufacturing Company has entered volume production of what it claims is the industry's first 40- volt, 0.18-micron, high voltage (HV) technology. The technology allows designers to produce single-chip TFT LCD drivers for portable applications, thereby reducing chip count, saving real estate and power, while providing the imaging performance necessary for advanced portable displays.

Available in 1.8-volt, 5-volt and 40-volt triple gate oxides, the process features a superior isolation scheme that allows highly reliable integration of low-voltage and high-voltage circuitry for the lifetime of the device, with minimal noise and excellent immunity to latch-up. "The design community has been anxiously awaiting the delivery of a 40-volt, low-power 0.18-micron process for volume production," said Genda Hu, vice president of marketing for TSMC. "This development enables a whole new class of display drivers."

The new process is based on, and fully compatible with, TSMC's industry-leading 180nm, low power process that maximizes power conservation. The process supports all logic and analog IP and libraries that are proven in TSMC's 0.18-micron low-power process, thereby providing not just a power and area savings, but a design budget savings as well. To enhance optimization of display quality for individual hand-held systems, TSMC is also developing special intellectual property (IP) elements enabling one-time programmability (OTP) and multiple-time programmability (MTP). These IPs are expected to be available in 2005 without additional process steps.

The TSMC 0.18-micron HV technology is also available on TSMC's Cybershuttle prototyping service for quick and inexpensive verification and engineering samples. Backend services, including gold bumping, are offered through TSMC as well.

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