|
DuPont Photomasks expands capabilities for 65nm |
|
|
|
Feb 04, 2005 at 05:00 PM |
DuPont Photomasks, is spending $30 million on a new production line for
90nm masks and 65nm mask prototyping. The new line includes a JEOL
JBX-3030MV e-beam pattern generator, a KLA-Tencor 576 inspection
system, a Rave advanced repair system, a next-generation dry etcher and
additional upgrades to process equipment.
The new line in Round Rock is expected to come on line quickly and ramp
to commercial production volumes by early 2005. The addition of this
state-of-the-art equipment will significantly expand DuPont Photomasks'
ability to offer volume photomask production at 90nm.
"This upgrade at our advanced photomask production facility in Round
Rock significantly enhances our ability to offer our customers
throughout the world the very latest photomask technology for wafer
production," said Jim Northup, chief operating officer of DuPont
Photomasks. "But state-of-the-art tools are only part of the solution.
The proprietary processes developed by our engineering teams will help
ensure that customers get the highest-quality photomasks that increase
wafer yield for semiconductor design nodes in production today,
tomorrow and the years ahead."
Toppan Printing Co., Ltd. and DuPont Photomasks, Inc. entered into a
definitive agreement in October 2004, under which Toppan will acquire
all of the outstanding shares of DuPont Photomasks. Following
completion of the proposed transaction, DuPont Photomasks will become a
wholly owned subsidiary of Toppan and will remain headquartered in
Round Rock, Texas.
|
News 
