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Cypress's SVTC installs 200-and 300-mm lithography |
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Feb 04, 2005 at 07:00 AM |
Silicon Valley Technology Center (SVTC), a division of Cypress
Semiconductor Corp. has become the first R&D services provider
offering 65nm silicon processing capabilities to thirdparty companies
with the installation of a new 200- and 300-mm wafer photolithography
tool from ASML.
The new ASML TWINSCAN(TM) XT:1250, a high numerical aperture (0.85),
193nm scanner, will be available to established and startup companies
who are looking for advanced lithography capabilities on the sub-90-nm
technology nodes. In addition to the litho cell, the processing cluster
includes a resist coat and develop track, along with associated CD-SEM
and overlay metrology tools.
"This new lithography cell puts SVTC's world-class capabilities inline
with the advanced technology development forecast of the International
Technology Roadmap for Semiconductors," said Bert Bruggeman, SVTC's
managing director. "SVTC provides cuttingedge lithography services for
companies that want to develop their novel silicon processes at the
most progressive technology nodes available today."
SVTC offers an alternative strategy for taking a product from
proof-of-concept to manufacturing through a state-of-the-art,
foundry-compatible toolset in a 16,000 square-foot clean room in
Silicon Valley.
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