Online information source for semiconductor professionals
Grand challenges of advanced resist technology
Popular articles
Micron moving fast on Hynix in Q208 NAND flash rankings, says iSuppli - 19 August 2008
Numonyx to close California Technology Center - 12 August 2008
Qimonda starts major reorganization: exits PC DRAM market - 13 October 2008
Micron close to Inotera share purchase, says Gartner - 06 October 2008
Applied Materials sees higher CapEx spending for 2009 - 15 August 2008
Jan Makos-Brotherton, Texas Instruments Assignee to SEMATECH, Will Conley, Freescale Semiconductor Assignee to SEMATECH, Kim Dean, SEMATECH, Jeff Meute IBM Assignee to SEMATECH, & Karen Turnquest, AMD Assignee to SEMATECH, Austin, TX, USA
ABSTRACT
As the semiconductor industry struggles to maintain the pace set by Moore’s Law, the lithography research community must take on new challenges to ensure robust resist performance. Current research continues on parallel paths for extreme ultraviolet (EUV) and 193-nm immersion technologies, stretching available resources to solve critical issues in line-edge roughness (LER), sensitivity, resolution, etch resistance, and optics contamination. SEMATECH is making progress in solving key issues of cutting-edge technologies with the help and cooperation of suppliers, universities, national labs, and other consortia.
 |
Please login to download the paper. No account yet? Please register. It's free! |